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Test cost analysis for 3D die-to-wafer stacking

dc.contributor.authorTaouil, Mottaqiallah
dc.contributor.authorHamdioui, Said
dc.contributor.authorBeenakker, Kees
dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2021-10-18T22:12:58Z
dc.date.available2021-10-18T22:12:58Z
dc.date.issued2010-12
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18069
dc.sourceIIOimport
dc.titleTest cost analysis for 3D die-to-wafer stacking
dc.typeProceedings paper
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewyes
dc.source.beginpage435
dc.source.endpage441
dc.source.conferenceIEEE Asian Test Symposium - ATS
dc.source.conferencedate1/12/2010
dc.source.conferencelocationShanghai China
imec.availabilityPublished - imec


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