Publication:
Modeling Ar/Cl2/O2 and Ar/SiH4/O2 Inductively Coupled Plasmas used for anisotropic etching of silicon and deposition of SiOx
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1874 since deposited on 2021-10-18
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Acq. date: 2026-05-02
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Statistics
Views
1874 since deposited on 2021-10-18
1last month
1last week
Acq. date: 2026-05-02
Citations