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Recent advances in copper based interconnect reliability

dc.contributor.authorTokei, Zsolt
dc.contributor.authorCroes, Kristof
dc.contributor.authorDemuynck, Steven
dc.contributor.authorKauerauf, Thomas
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-18T22:22:40Z
dc.date.available2021-10-18T22:22:40Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18091
dc.sourceIIOimport
dc.titleRecent advances in copper based interconnect reliability
dc.typeMeeting abstract
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewno
dc.source.beginpageF1.1
dc.source.conferenceMRS Spring Meeting Symposium F: Materials, Processes, Integration, and Reliability in Advanced Interconnects for Micro- and Nano
dc.source.conferencedate4/04/2010
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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