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SLIM-cut thin silicon wafering with enhanced crack and stress control

dc.contributor.authorVaes, Jan
dc.contributor.authorMasolin, Alex
dc.contributor.authorPesquera Rodriguez, Amaia
dc.contributor.authorDross, Frederic
dc.date.accessioned2021-10-18T22:37:48Z
dc.date.available2021-10-18T22:37:48Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18123
dc.sourceIIOimport
dc.titleSLIM-cut thin silicon wafering with enhanced crack and stress control
dc.typeProceedings paper
dc.source.peerreviewno
dc.source.beginpage777212
dc.source.conferenceNext Generation (Nano) Photonic and Cell Technologies for Solar Energy
dc.source.conferencedate2/08/2010
dc.source.conferencelocationSan Diego, CA USA
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 7772


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