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Si recess etch for 3D stacked IC applications.

dc.contributor.authorVan Cauwenberghe, Marc
dc.contributor.authorTutunjyan, Nina
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorJourdain, Anne
dc.contributor.authorConard, Thierry
dc.contributor.authorBoullart, Werner
dc.contributor.authorTravaly, Youssef
dc.contributor.authorSwinnen, Bart
dc.date.accessioned2021-10-18T22:51:01Z
dc.date.available2021-10-18T22:51:01Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18153
dc.sourceIIOimport
dc.titleSi recess etch for 3D stacked IC applications.
dc.typeMeeting abstract
dc.contributor.imecauthorVan Cauwenberghe, Marc
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorBoullart, Werner
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.source.peerreviewno
dc.source.conference3rd International Plasma Etch and Strip in Microelectronics Workshop - PESM
dc.source.conferencedate4/03/2010
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec


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