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Design issues and cosiderations for low-cost 3D TSV IC technology

dc.contributor.authorVan der Plas, Geert
dc.contributor.authorLimaye, Paresh
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorOprins, Herman
dc.contributor.authorTorregiani, Cristina
dc.contributor.authorThijs, Steven
dc.contributor.authorLinten, Dimitri
dc.contributor.authorStucchi, Michele
dc.contributor.authorGuruprasad, Katti
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorShinichi, Domae
dc.contributor.authorCherman, Vladimir
dc.contributor.authorVandevelde, Bart
dc.contributor.authorSimons, Veerle
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorLabie, Riet
dc.contributor.authorPerry, Dan
dc.contributor.authorBronckers, Stephane
dc.contributor.authorMinas, Nikolaos
dc.contributor.authorCupak, Miroslav
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorde Potter de ten Broeck, Muriel
dc.contributor.authorOpdebeeck, Ann
dc.contributor.authorRakowski, Michal
dc.contributor.authorDe Wachter, Bart
dc.contributor.authorDehan, Morin
dc.contributor.authorNelis, Marc
dc.contributor.authorAgarwal, Rahul
dc.contributor.authorDehaene, Wim
dc.contributor.authorTravaly, Youssef
dc.contributor.authorMarchal, Pol
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-18T22:57:34Z
dc.date.available2021-10-18T22:57:34Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18167
dc.sourceIIOimport
dc.titleDesign issues and cosiderations for low-cost 3D TSV IC technology
dc.typeProceedings paper
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorThijs, Steven
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorSimons, Veerle
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorCupak, Miroslav
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorde Potter de ten Broeck, Muriel
dc.contributor.imecauthorOpdebeeck, Ann
dc.contributor.imecauthorRakowski, Michal
dc.contributor.imecauthorDe Wachter, Bart
dc.contributor.imecauthorDehaene, Wim
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecThijs, Steven::0000-0003-2889-8345
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecSimons, Veerle::0000-0001-5714-955X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage148
dc.source.endpage149
dc.source.conferenceIEEE International Solid-State Circuits Conference - ISSCC
dc.source.conferencedate8/02/2010
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access


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