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Numerical and experimental analysis of stretching induced interconnect delamination for stretchable electronic circuits

dc.contributor.authorvan der Sluis, Olaf
dc.contributor.authorHsu, Yung-Yu
dc.contributor.authorTimmermans, P.H.M.
dc.contributor.authorGonzalez, Mario
dc.contributor.authorHoefnagels, J.P.M.
dc.date.accessioned2021-10-18T22:59:06Z
dc.date.available2021-10-18T22:59:06Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18170
dc.sourceIIOimport
dc.titleNumerical and experimental analysis of stretching induced interconnect delamination for stretchable electronic circuits
dc.typeMeeting abstract
dc.contributor.imecauthorGonzalez, Mario
dc.source.peerreviewyes
dc.source.conference18th European Conference on Fracture, Fracture of Materials and Structures from Micro to Macro Scale
dc.source.conferencedate30/08/2010
dc.source.conferencelocationDresden Germany
imec.availabilityPublished - imec


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