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Thermo-mechanical design of a generic 0-level MEMS package using chip capping and Through Silicon Via's

dc.contributor.authorVandevelde, Bart
dc.contributor.authorJansen, Roelof
dc.contributor.authorBouwstra, Siebe
dc.contributor.authorPham, Nga
dc.contributor.authorMajeed, Bivragh
dc.contributor.authorLimaye, Paresh
dc.contributor.authorBeyne, Eric
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-18T23:26:00Z
dc.date.available2021-10-18T23:26:00Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18227
dc.sourceIIOimport
dc.titleThermo-mechanical design of a generic 0-level MEMS package using chip capping and Through Silicon Via's
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorJansen, Roelof
dc.contributor.imecauthorPham, Nga
dc.contributor.imecauthorMajeed, Bivragh
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecJansen, Roelof::0000-0001-6685-4699
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.contributor.orcidimecMajeed, Bivragh::0000-0002-1535-4544
dc.source.peerreviewno
dc.source.conference11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics - EuroSimE
dc.source.conferencedate26/04/2010
dc.source.conferencelocationBordeaux France
imec.availabilityPublished - imec


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