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Mechanical and thermo-mechanical behavior of electroplated Copper Through Silicon Vias

dc.contributor.authorVanstreels, Kris
dc.contributor.authorOkoro, Chukwudi
dc.contributor.authorLabie, Riet
dc.date.accessioned2021-10-18T23:32:51Z
dc.date.available2021-10-18T23:32:51Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18242
dc.sourceIIOimport
dc.titleMechanical and thermo-mechanical behavior of electroplated Copper Through Silicon Vias
dc.typeMeeting abstract
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorLabie, Riet
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.source.peerreviewno
dc.source.conferenceNanomeasure Symposium
dc.source.conferencedate3/06/2010
dc.source.conferencelocationKrakow Poland
imec.availabilityPublished - imec


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