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On the cost-effectiveness of matching repositories of pre-tested wafers for wafer-to-wafer 3D chip stacking

dc.contributor.authorVerbree, Jouke
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorRoussel, Philippe
dc.contributor.authorVelenis, Dimitrios
dc.date.accessioned2021-10-18T23:39:25Z
dc.date.available2021-10-18T23:39:25Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18256
dc.sourceIIOimport
dc.titleOn the cost-effectiveness of matching repositories of pre-tested wafers for wafer-to-wafer 3D chip stacking
dc.typeProceedings paper
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.imecauthorRoussel, Philippe
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.contributor.orcidimecRoussel, Philippe::0000-0002-0402-8225
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage36
dc.source.endpage41
dc.source.conference15th IEEE European Test Symposium - ETS
dc.source.conferencedate24/05/2010
dc.source.conferencelocationPrague Czech Republic
dc.identifier.urlhttp://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5512785
imec.availabilityPublished - open access


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