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Mechanistic insights of copper damascene plating in small and large features

dc.contributor.authorVereecken, Philippe
dc.contributor.authorRuythooren, Wouter
dc.date.accessioned2021-10-18T23:44:29Z
dc.date.available2021-10-18T23:44:29Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18267
dc.sourceIIOimport
dc.titleMechanistic insights of copper damascene plating in small and large features
dc.typeMeeting abstract
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage1994
dc.source.conference218th ECS Meeting Symposium 'Electronics and 3-D Packaging 4'
dc.source.conferencedate10/10/2010
dc.source.conferencelocationLas Vegas, NV USA
dc.identifier.urlhttp://ecsmeet3.peerx-press.org/jsp/mas/reportTechProg.jsp?MEETING_ID=101&SYM_ID=143#abs1994
imec.availabilityPublished - open access
imec.internalnotesMeeting Abstracts; Vol. 2010-02


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