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Experimental and analytical evaluation of stress fields fenerated by solder bump interconnections

dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorSoper, A.
dc.contributor.authorPozza, G.
dc.contributor.authorIgnat, M.
dc.contributor.authorParat, G.
dc.contributor.authorMaes, Herman
dc.date.accessioned2021-09-30T08:08:23Z
dc.date.available2021-09-30T08:08:23Z
dc.date.issued1997
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1830
dc.sourceIIOimport
dc.titleExperimental and analytical evaluation of stress fields fenerated by solder bump interconnections
dc.typeProceedings paper
dc.contributor.imecauthorDe Wolf, Ingrid
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage261
dc.source.endpage266
dc.source.conferenceProceedings of the International Conference and Exhibition Micro Materials - Micro Mat
dc.source.conferencedate16/04/1997
dc.source.conferencelocationBerlin Germany
imec.availabilityPublished - open access


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