Predicting PCB delamination in lead-free assembly

dc.contributor.author	Willems, Geert
dc.contributor.author	Watte, Piet
dc.date.accessioned	2021-10-19T00:28:24Z
dc.date.available	2021-10-19T00:28:24Z
dc.date.issued	2010
dc.identifier.issn	1474-0893
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/18355
dc.source	IIOimport
dc.title	Predicting PCB delamination in lead-free assembly
dc.type	Journal article
dc.contributor.imecauthor	Willems, Geert
dc.contributor.orcidimec	Willems, Geert::0000-0002-9137-618X
dc.date.embargo	9999-12-31
dc.source.peerreview	no
dc.source.beginpage	10
dc.source.endpage	16
dc.source.journal	Global SMT & Packaging
dc.source.issue	9
dc.source.volume	10
dc.identifier.url	www.globalsmt.net
imec.availability	Published - open access