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Articles
Predicting PCB delamination in lead-free assembly
Publication:
Predicting PCB delamination in lead-free assembly
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Date
2010
Journal article
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21235.pdf
6.63 MB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Willems, Geert
;
Watte, Piet
Journal
Global SMT & Packaging
Abstract
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1850
since deposited on 2021-10-19
Acq. date: 2025-12-16
Citations
Metrics
Views
1850
since deposited on 2021-10-19
Acq. date: 2025-12-16
Citations