Publication:

Predicting PCB delamination in lead-free assembly

Date

2010
Journal article
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dc.contributor.authorWillems, Geert
dc.contributor.authorWatte, Piet
dc.contributor.imecauthorWillems, Geert
dc.contributor.orcidimecWillems, Geert::0000-0002-9137-618X
dc.date.accessioned2021-10-19T00:28:24Z
dc.date.available2021-10-19T00:28:24Z
dc.date.embargo9999-12-31
dc.date.issued2010
dc.identifier.issn1474-0893
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18355
dc.identifier.urlwww.globalsmt.net
dc.source.beginpage10
dc.source.endpage16
dc.source.issue9
dc.source.journalGlobal SMT & Packaging
dc.source.volume10
dc.title

Predicting PCB delamination in lead-free assembly

dc.typeJournal article
dspace.entity.typePublication
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