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Analysis and characterization of a mechanical sensor to monitor stress in interconnect features

dc.contributor.authorWilson, Chris
dc.contributor.authorCroes, Kristof
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyer, Gerald
dc.contributor.authorGallacher, Barry
dc.contributor.authorBull, Steve
dc.contributor.authorHorsfall, Alton
dc.contributor.authorO'Neill, Anthony
dc.date.accessioned2021-10-19T00:28:56Z
dc.date.available2021-10-19T00:28:56Z
dc.date.issued2010
dc.identifier.issn0040-6090
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18356
dc.sourceIIOimport
dc.titleAnalysis and characterization of a mechanical sensor to monitor stress in interconnect features
dc.typeJournal article
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage443
dc.source.endpage449
dc.source.journalThin Solid Films
dc.source.issue1
dc.source.volume519
imec.availabilityPublished - imec


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