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Simulation of the effect of microstructure on the elastic properties of copper interconnects
Publication:
Simulation of the effect of microstructure on the elastic properties of copper interconnects
Date
2010
Presentation
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wilson, Chris
;
Oila, A.
;
Sanderson, L.
;
Bull, S.
;
Raskin, Jean-Pierre
;
Croes, Kristof
;
Horsfall, A.
;
O'Neill, A.
;
Tokei, Zsolt
;
Beyer, Gerald
Journal
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Views
1940
since deposited on 2021-10-19
Acq. date: 2025-10-26
Citations
Metrics
Views
1940
since deposited on 2021-10-19
Acq. date: 2025-10-26
Citations