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Simulation of the effect of microstructure on the elastic properties of copper interconnects
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Authors
Wilson, Chris
;
Oila, A.
;
Sanderson, L.
;
Bull, S.
;
Raskin, Jean-Pierre
;
Croes, Kristof
;
Horsfall, A.
;
O'Neill, A.
;
Tokei, Zsolt
;
Beyer, Gerald
Conference
11th International Workshop on Stress-Induced Phenomena in Metallization
Title
Simulation of the effect of microstructure on the elastic properties of copper interconnects
Publication type
Oral presentation
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