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Thermomechanical design and modeling of porous alumina-based thin film packages for MEMS

dc.contributor.authorZekry, Joseph
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBouwstra, Siebe
dc.contributor.authorPuers, Bob
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-19T00:54:10Z
dc.date.available2021-10-19T00:54:10Z
dc.date.issued2010-04
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18406
dc.sourceIIOimport
dc.titleThermomechanical design and modeling of porous alumina-based thin film packages for MEMS
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorPuers, Bob
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.conference11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics - EuroSimE
dc.source.conferencedate26/04/2010
dc.source.conferencelocationBordeaux France
imec.availabilityPublished - imec


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