dc.contributor.author | Zekry, Joseph | |
dc.contributor.author | Vandevelde, Bart | |
dc.contributor.author | Bouwstra, Siebe | |
dc.contributor.author | Puers, Bob | |
dc.contributor.author | Van Hoof, Chris | |
dc.contributor.author | Tilmans, Harrie | |
dc.date.accessioned | 2021-10-19T00:54:10Z | |
dc.date.available | 2021-10-19T00:54:10Z | |
dc.date.issued | 2010-04 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18406 | |
dc.source | IIOimport | |
dc.title | Thermomechanical design and modeling of porous alumina-based thin film packages for MEMS | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vandevelde, Bart | |
dc.contributor.imecauthor | Puers, Bob | |
dc.contributor.imecauthor | Van Hoof, Chris | |
dc.contributor.imecauthor | Tilmans, Harrie | |
dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
dc.contributor.orcidimec | Tilmans, Harrie::0000-0003-4240-4962 | |
dc.source.peerreview | no | |
dc.source.conference | 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics - EuroSimE | |
dc.source.conferencedate | 26/04/2010 | |
dc.source.conferencelocation | Bordeaux France | |
imec.availability | Published - imec | |