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Surface planarization of Cu/Sn micro-bump and its application in fine pitch Cu/Sn solid state diffusion bonding

dc.contributor.authorZhang, Wenqi
dc.contributor.authorLimaye, Paresh
dc.contributor.authorAgarwal, Rahul
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-19T01:00:20Z
dc.date.available2021-10-19T01:00:20Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18418
dc.sourceIIOimport
dc.titleSurface planarization of Cu/Sn micro-bump and its application in fine pitch Cu/Sn solid state diffusion bonding
dc.typeProceedings paper
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.source.peerreviewyes
dc.source.beginpage143
dc.source.endpage146
dc.source.conference12th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate8/12/2010
dc.source.conferencelocationSingapore
imec.availabilityPublished - imec


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