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Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration

dc.contributor.authorZhang, Wenqi
dc.contributor.authorLimaye, Paresh
dc.contributor.authorCivale, Yann
dc.contributor.authorLabie, Riet
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-19T01:00:48Z
dc.date.available2021-10-19T01:00:48Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18419
dc.sourceIIOimport
dc.titleFine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration
dc.typeProceedings paper
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.source.peerreviewyes
dc.source.conferenceElectronics System Integration Technology Conference - ESTC
dc.source.conferencedate13/09/2010
dc.source.conferencelocationBerlin Germany
imec.availabilityPublished - imec


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