dc.contributor.author | Zhao, Larry | |
dc.contributor.author | Baklanov, Mikhaïl | |
dc.contributor.author | Pantouvaki, Marianna | |
dc.contributor.author | Tokei, Zsolt | |
dc.contributor.author | Beyer, Gerald | |
dc.date.accessioned | 2021-10-19T01:02:46Z | |
dc.date.available | 2021-10-19T01:02:46Z | |
dc.date.issued | 2010 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18423 | |
dc.source | IIOimport | |
dc.title | Ultra low-k materials: challenges of scaling | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Pantouvaki, Marianna | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 117 | |
dc.source.endpage | 123 | |
dc.source.conference | Processing, Materials and Integration of Damascene and 3D Interconnects | |
dc.source.conferencedate | 10/10/2010 | |
dc.source.conferencelocation | Las Vegas, NV USA | |
imec.availability | Published - open access | |
imec.internalnotes | ECS Transactions; Vol. 33, Issue 12 | |