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Fabrication technique of a compressible biocompatible interconnect using a thin film transfer process

dc.contributor.authorAarts, Arno
dc.contributor.authorSrivannavit, O
dc.contributor.authorWise, K.D.
dc.contributor.authorYoon, E.
dc.contributor.authorPuers, Bob
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorPereira Neves, Hercules
dc.date.accessioned2021-10-19T12:28:14Z
dc.date.available2021-10-19T12:28:14Z
dc.date.issued2011
dc.identifier.issn0960-1317
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18437
dc.sourceIIOimport
dc.titleFabrication technique of a compressible biocompatible interconnect using a thin film transfer process
dc.typeJournal article
dc.contributor.imecauthorAarts, Arno
dc.contributor.imecauthorPuers, Bob
dc.contributor.imecauthorVan Hoof, Chris
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage74012
dc.source.journalJournal of Micromechanics and Microengineering
dc.source.issue7
dc.source.volume21
dc.identifier.urlhttp://iopscience.iop.org/0960-1317/21/7/074012/pdf/0960-1317_21_7_074012.pdf
imec.availabilityPublished - open access


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