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On the impact of the edge profile of interconnects on the occurrence of passivation cracks of plastic-encapsulated electronic power devices
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On the impact of the edge profile of interconnects on the occurrence of passivation cracks of plastic-encapsulated electronic power devices
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Date
2011
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ackaert, Jan
;
Vanderstraeten, Daniel
;
Vandevelde, Bart
Journal
Abstract
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2045
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Acq. date: 2026-01-07
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Views
2045
since deposited on 2021-10-19
1
last month
Acq. date: 2026-01-07
Citations