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High level analysis of trade-offs across different partitioning schemes for wireless applications

dc.contributor.authorAgrawal, Prashant
dc.contributor.authorFasthuber, Robert
dc.contributor.authorRaghavan, Praveen
dc.contributor.authorVander Aa, Tom
dc.contributor.authorAhmad, Ubaid
dc.contributor.authorVan der Perre, Liesbet
dc.contributor.authorCatthoor, Francky
dc.date.accessioned2021-10-19T12:28:37Z
dc.date.available2021-10-19T12:28:37Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18460
dc.sourceIIOimport
dc.titleHigh level analysis of trade-offs across different partitioning schemes for wireless applications
dc.typeProceedings paper
dc.contributor.imecauthorAgrawal, Prashant
dc.contributor.imecauthorVander Aa, Tom
dc.contributor.imecauthorCatthoor, Francky
dc.contributor.orcidimecVander Aa, Tom::0000-0002-1504-5266
dc.contributor.orcidimecCatthoor, Francky::0000-0002-3599-8515
dc.source.peerreviewyes
dc.source.conferenceIEEE Workshop on Signal Processing Systems - SIPS
dc.source.conferencedate4/10/2011
dc.source.conferencelocationBeirut Lebanon
imec.availabilityPublished - imec


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