Authors

Armini, Silvia; Demuynck, Steven; El-Mekki, Zaid; Swerts, Johan; Nagar, Magi; Radisic, Alex; Heylen, Nancy; Beyer, Gerald; Leunissen, Peter; Vereecken, Philippe

Conference

Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications

Title

Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments

Publication type

Proceedings paper

Embargo date

9999-12-31