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Ultra-low copper baths for sub-30nm copper interconnects

dc.contributor.authorAtanasova, Tanya
dc.contributor.authorCaluwaerts, Rudy
dc.contributor.authorCarbonell, Laure
dc.contributor.authorStrubbe, Katrien
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-19T12:30:08Z
dc.date.available2021-10-19T12:30:08Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18499
dc.sourceIIOimport
dc.titleUltra-low copper baths for sub-30nm copper interconnects
dc.typeMeeting abstract
dc.contributor.imecauthorCaluwaerts, Rudy
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.source.peerreviewno
dc.source.beginpage2330
dc.source.conference220th ECS Fall Meeting Symposium F4: Semiconductors, Metal Oxides and Composites
dc.source.conferencedate9/10/2011
dc.source.conferencelocationBoston, MA USA
imec.availabilityPublished - imec


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