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FIB/SEM structural analysis of through-silicon-vias

dc.contributor.authorBender, Hugo
dc.contributor.authorDrijbooms, Chris
dc.contributor.authorRadisic, Alex
dc.date.accessioned2021-10-19T12:33:14Z
dc.date.available2021-10-19T12:33:14Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18549
dc.sourceIIOimport
dc.titleFIB/SEM structural analysis of through-silicon-vias
dc.typeProceedings paper
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorDrijbooms, Chris
dc.contributor.imecauthorRadisic, Alex
dc.source.peerreviewno
dc.source.beginpage274
dc.source.endpage278
dc.source.conferenceFrontiers of Characterization and Metrology for Nanoelectronics
dc.source.conferencedate24/05/2011
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec
imec.internalnotesAIP Conference Seriers; Vol. 1395


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