dc.contributor.author | Bender, Hugo | |
dc.contributor.author | Drijbooms, Chris | |
dc.contributor.author | Radisic, Alex | |
dc.date.accessioned | 2021-10-19T12:33:18Z | |
dc.date.available | 2021-10-19T12:33:18Z | |
dc.date.issued | 2011 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18550 | |
dc.source | IIOimport | |
dc.title | FIB/SEM structural analysis of through-silicon-vias | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Bender, Hugo | |
dc.contributor.imecauthor | Drijbooms, Chris | |
dc.contributor.imecauthor | Radisic, Alex | |
dc.source.peerreview | no | |
dc.source.conference | European FIB User Group Meeting | |
dc.source.conferencedate | 3/10/2011 | |
dc.source.conferencelocation | Bordeaux France | |
imec.availability | Published - imec | |