Show simple item record

Remaining issues in 3D integration – Carrier systems for 3D TSV thinning and backside processing

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-19T12:34:41Z
dc.date.available2021-10-19T12:34:41Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18567
dc.sourceIIOimport
dc.titleRemaining issues in 3D integration – Carrier systems for 3D TSV thinning and backside processing
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceSuss Microtec 3D Integration Workshop: Are We There Yet?
dc.source.conferencedate12/07/2011
dc.source.conferencelocationSan Francisco, CA US
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record