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Standardization requirements for 3D-TSV system integration

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-19T12:34:49Z
dc.date.available2021-10-19T12:34:49Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18569
dc.sourceIIOimport
dc.titleStandardization requirements for 3D-TSV system integration
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceSemi SiP Global Summit 2011-3D IC Technology Forum
dc.source.conferencedate8/09/2011
dc.source.conferencelocationTaipei Taiwan
imec.availabilityPublished - imec


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