Show simple item record

From C4 PbSn flip chip to Lead-free μbump flip chip

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-19T12:34:54Z
dc.date.available2021-10-19T12:34:54Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18570
dc.sourceIIOimport
dc.titleFrom C4 PbSn flip chip to Lead-free μbump flip chip
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceSeminar "Vijf jaar Loodvrij Solderen"
dc.source.conferencedate22/09/2011
dc.source.conferencelocationEindhoven The Netherlands
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record