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3D integration challenges and progress: from TSV to stacked die technologies

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-19T12:35:08Z
dc.date.available2021-10-19T12:35:08Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18573
dc.sourceIIOimport
dc.title3D integration challenges and progress: from TSV to stacked die technologies
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceIEEE-CPMT Orange County Chapter Seminar "3D Integrated Circuits: Technologies Enabling the Revolution"
dc.source.conferencedate9/12/2011
dc.source.conferencelocationNewport Beach, CA USA
imec.availabilityPublished - imec


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