Show simple item record

Challenges in 3D system integration beyond TSV processing

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-19T12:35:13Z
dc.date.available2021-10-19T12:35:13Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18574
dc.sourceIIOimport
dc.titleChallenges in 3D system integration beyond TSV processing
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conference3-D Architectures for Semiconductor Integration and Packaging
dc.source.conferencedate12/12/2011
dc.source.conferencelocationBurlingame, CA USA
imec.availabilityPublished - imec


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following collection(s)

Show simple item record