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Co-Integration challenges for 3D-TSV and advanced devices

dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-19T12:35:17Z
dc.date.available2021-10-19T12:35:17Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18575
dc.sourceIIOimport
dc.titleCo-Integration challenges for 3D-TSV and advanced devices
dc.typeProceedings paper
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceSemicon West, "3D in the Deep Submicron Era" Session
dc.source.conferencedate13/07/2011
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - imec


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