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Failure analysis for 3D TSV systems

dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-19T12:35:26Z
dc.date.available2021-10-19T12:35:26Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18577
dc.sourceIIOimport
dc.titleFailure analysis for 3D TSV systems
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.conferenceStress Management for 3D IC's Using Through Silicon Vias: Product-Level Reliability Workshop
dc.source.conferencedate14/07/2011
dc.source.conferencelocationSan Francisco, CA US
imec.availabilityPublished - imec


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