dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Konijnenburg, Mario | |
dc.contributor.author | Marinissen, Erik Jan | |
dc.contributor.author | Jensen, Lisa | |
dc.contributor.author | Deutsch, Sergej | |
dc.contributor.author | Chikermane, Vivek | |
dc.contributor.author | Keller, Brion | |
dc.contributor.author | Mukherjee, Subhasish | |
dc.contributor.author | Goel, Sandeep | |
dc.date.accessioned | 2021-10-19T12:35:32Z | |
dc.date.available | 2021-10-19T12:35:32Z | |
dc.date.issued | 2011 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18578 | |
dc.source | IIOimport | |
dc.title | Automation of DfT for 3-D stacked die | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Konijnenburg, Mario | |
dc.contributor.imecauthor | Marinissen, Erik Jan | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Konijnenburg, Mario::0000-0001-8016-0888 | |
dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
dc.source.peerreview | no | |
dc.source.conference | 3-D Architectures for Semiconductor Integration and Packaging, 3-D ASIP | |
dc.source.conferencedate | 12/12/2011 | |
dc.source.conferencelocation | Burlingame, CA USA | |
imec.availability | Published - imec | |