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Temporary 0-level MEMS packaging using a heat decomposable sealing ring

dc.contributor.authorBogaerts, Lieve
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorGerets, Carine
dc.contributor.authorJaenen, Patrick
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorSeveri, Simone
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorSoussan, Philippe
dc.contributor.authorWitvrouw, Ann
dc.contributor.authorBeernaert, Roel
dc.contributor.authorRudra, Sukumar
dc.date.accessioned2021-10-19T12:36:25Z
dc.date.available2021-10-19T12:36:25Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18588
dc.sourceIIOimport
dc.titleTemporary 0-level MEMS packaging using a heat decomposable sealing ring
dc.typeProceedings paper
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorJaenen, Patrick
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.imecauthorSeveri, Simone
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.source.peerreviewno
dc.source.beginpage1497
dc.source.endpage1500
dc.source.conferenceEurosensors XXV
dc.source.conferencedate4/09/2011
dc.source.conferencelocationAthens Greece
imec.availabilityPublished - imec
imec.internalnotesProcedia Engineering; Vol. 25


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