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Packaging technology enabling flexible optical interconnections

dc.contributor.authorBosman, Erwin
dc.contributor.authorVan Steenberge, Geert
dc.contributor.authorMissinne, Jeroen
dc.contributor.authorVan Hoe, Bram
dc.contributor.authorKalathimekkad, Sandeep
dc.contributor.authorVan Daele, Peter
dc.date.accessioned2021-10-19T12:38:23Z
dc.date.available2021-10-19T12:38:23Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18607
dc.sourceIIOimport
dc.titlePackaging technology enabling flexible optical interconnections
dc.typeProceedings paper
dc.contributor.imecauthorVan Steenberge, Geert
dc.contributor.imecauthorMissinne, Jeroen
dc.contributor.imecauthorVan Daele, Peter
dc.contributor.orcidimecVan Steenberge, Geert::0000-0001-8574-1235
dc.contributor.orcidimecMissinne, Jeroen::0000-0002-3470-620X
dc.contributor.orcidimecVan Daele, Peter::0000-0003-0557-7741
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage79440E
dc.source.conferenceOptoelectronic Interconnects and Component Integration XI
dc.source.conferencedate22/01/2011
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access
imec.internalnotesProceedings of SPIE; Vol. 7944


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