dc.contributor.author | Buisson, Thibault | |
dc.contributor.author | Potoms, Goedele | |
dc.contributor.author | Phommahaxay, Alain | |
dc.contributor.author | Verbinnen, Greet | |
dc.contributor.author | Jaenen, Patrick | |
dc.contributor.author | La Manna, Antonio | |
dc.contributor.author | Travaly, Youssef | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-19T12:40:56Z | |
dc.date.available | 2021-10-19T12:40:56Z | |
dc.date.issued | 2011 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18630 | |
dc.source | IIOimport | |
dc.title | Integration challenges of Cu pillars with extreme wafer thinning for 3D stacking and packaging | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Potoms, Goedele | |
dc.contributor.imecauthor | Phommahaxay, Alain | |
dc.contributor.imecauthor | Verbinnen, Greet | |
dc.contributor.imecauthor | Jaenen, Patrick | |
dc.contributor.imecauthor | La Manna, Antonio | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | no | |
dc.source.conference | 13th Electronics Packaging Technology Conference - EPTC | |
dc.source.conferencedate | 7/12/2011 | |
dc.source.conferencelocation | Singapore | |
imec.availability | Published - imec | |