dc.contributor.author | Civale, Yann | |
dc.contributor.author | Sabuncuoglu Tezcan, Deniz | |
dc.contributor.author | Philipsen, Harold | |
dc.contributor.author | Duval, Fabrice | |
dc.contributor.author | Jaenen, Patrick | |
dc.contributor.author | Travaly, Youssef | |
dc.contributor.author | Soussan, Philippe | |
dc.contributor.author | Swinnen, Bart | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-19T12:51:15Z | |
dc.date.available | 2021-10-19T12:51:15Z | |
dc.date.issued | 2011 | |
dc.identifier.issn | 2156-3950 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18702 | |
dc.source | IIOimport | |
dc.title | 3D wafer-level packaging die stacking using spin-on-dielectric polymer liner through-silicon vias | |
dc.type | Journal article | |
dc.contributor.imecauthor | Sabuncuoglu Tezcan, Deniz | |
dc.contributor.imecauthor | Philipsen, Harold | |
dc.contributor.imecauthor | Duval, Fabrice | |
dc.contributor.imecauthor | Jaenen, Patrick | |
dc.contributor.imecauthor | Soussan, Philippe | |
dc.contributor.imecauthor | Swinnen, Bart | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Sabuncuoglu Tezcan, Deniz::0000-0002-9237-7862 | |
dc.contributor.orcidimec | Philipsen, Harold::0000-0002-5029-1104 | |
dc.contributor.orcidimec | Soussan, Philippe::0000-0002-1347-6978 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 833 | |
dc.source.endpage | 840 | |
dc.source.journal | IEEE Transactions on Components, Packaging and Manufacturing Technology | |
dc.source.issue | 6 | |
dc.source.volume | 1 | |
imec.availability | Published - open access | |