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Poly-silicon germanium thin-film package: study of structural features enabling CMOS-MEMS integration

dc.contributor.authorClaes, Gert
dc.date.accessioned2021-10-19T12:51:23Z
dc.date.available2021-10-19T12:51:23Z
dc.date.issued2011-07
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18703
dc.sourceIIOimport
dc.titlePoly-silicon germanium thin-film package: study of structural features enabling CMOS-MEMS integration
dc.typePHD thesis
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.contributor.thesisadvisorCelis, Jean-Pierre
dc.contributor.thesisadvisorVan Hoof, Chris
imec.availabilityPublished - open access


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