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Reliability challenges related to TSV integration and 3D stacking

dc.contributor.authorCroes, Kristof
dc.date.accessioned2021-10-19T12:58:25Z
dc.date.available2021-10-19T12:58:25Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18749
dc.sourceIIOimport
dc.titleReliability challenges related to TSV integration and 3D stacking
dc.typeOral presentation
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewno
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate10/04/2011
dc.source.conferencelocationMonterey CA, USA
imec.availabilityPublished - imec
imec.internalnotesTutorial


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