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Reliability challenges of 3D stacked IC's

dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-19T12:58:34Z
dc.date.available2021-10-19T12:58:34Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18750
dc.sourceIIOimport
dc.titleReliability challenges of 3D stacked IC's
dc.typeOral presentation
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.conferenceChallenges for three-dimensional (3D) ICs and Systems
dc.source.conferencedate28/11/2011
dc.source.conferencelocationToulouse France
imec.availabilityPublished - imec


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