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Study of void formation kinetics in cu interconnects using local sense structures

dc.contributor.authorCroes, Kristof
dc.contributor.authorLofrano, Melina
dc.contributor.authorWilson, Chris
dc.contributor.authorCarbonell, Laure
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorBeyer, Gerald
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-19T12:58:56Z
dc.date.available2021-10-19T12:58:56Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18752
dc.sourceIIOimport
dc.titleStudy of void formation kinetics in cu interconnects using local sense structures
dc.typeProceedings paper
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage321
dc.source.endpage327
dc.source.conferenceIEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate10/04/2011
dc.source.conferencelocationMonterey, CA USA
imec.availabilityPublished - open access
imec.internalnotes3E.5


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