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Patterning of 25nm contact holes at 90nm pitch: combination of line/space double exposure immersion lithography and plasma-assisted shrink technology

dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorGoossens, Danny
dc.contributor.authorVandervorst, Alain
dc.contributor.authorRichard, Olivier
dc.contributor.authorShamiryan, Denis
dc.contributor.authorXu, Kaidong
dc.contributor.authorTruffert, Vincent
dc.contributor.authorBoullart, Werner
dc.date.accessioned2021-10-19T13:05:33Z
dc.date.available2021-10-19T13:05:33Z
dc.date.issued2011
dc.identifier.issn0021-4922
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18788
dc.sourceIIOimport
dc.titlePatterning of 25nm contact holes at 90nm pitch: combination of line/space double exposure immersion lithography and plasma-assisted shrink technology
dc.typeJournal article
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorGoossens, Danny
dc.contributor.imecauthorRichard, Olivier
dc.contributor.imecauthorTruffert, Vincent
dc.contributor.imecauthorBoullart, Werner
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecRichard, Olivier::0000-0002-3994-8021
dc.contributor.orcidimecTruffert, Vincent::0000-0001-7851-830X
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.source.peerreviewyes
dc.source.beginpage08JE07
dc.source.journalJapanese Journal of Applied Physics
dc.source.issue8
dc.source.volume50
imec.availabilityPublished - imec


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