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Raman spectroscopy analysis of mechanical stress near Cu-TSVs

dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-19T13:09:52Z
dc.date.available2021-10-19T13:09:52Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18811
dc.sourceIIOimport
dc.titleRaman spectroscopy analysis of mechanical stress near Cu-TSVs
dc.typeProceedings paper
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.beginpage138
dc.source.endpage149
dc.source.conferenceStress Management for 3D ICs Using Through Silicon Vias
dc.source.conferencedate16/03/2010
dc.source.conferencelocationDresden Germany
dc.identifier.urlhttp://scitation.aip.org/dbt/dbt.jsp?KEY=APCPCS&Volume=1378&Issue=1
imec.availabilityPublished - imec
imec.internalnotesAIP Conference Proceedings; Vol. 1378


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