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Conformal antenna-in-package solution implemented in a 3D flex-rigid multilayer PCB technology

dc.contributor.authorEnayati, Amin
dc.contributor.authorLibois, Michael
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorVandenbosch, Guy
dc.date.accessioned2021-10-19T13:24:51Z
dc.date.available2021-10-19T13:24:51Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18880
dc.sourceIIOimport
dc.titleConformal antenna-in-package solution implemented in a 3D flex-rigid multilayer PCB technology
dc.typeProceedings paper
dc.contributor.imecauthorLibois, Michael
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage4
dc.source.conferenceAsian-Pacific Microwave Conference
dc.source.conferencedate5/12/2011
dc.source.conferencelocationMelbourne Australia
imec.availabilityPublished - imec


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