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Multilayer PCB technology for antenna-in-package solution at millimetre-wave frequencies

dc.contributor.authorEnayati, Amin
dc.contributor.authorVandenbosch, Guy
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorRaisanen, Antti
dc.date.accessioned2021-10-19T13:25:33Z
dc.date.available2021-10-19T13:25:33Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18883
dc.sourceIIOimport
dc.titleMultilayer PCB technology for antenna-in-package solution at millimetre-wave frequencies
dc.typeProceedings paper
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.source.peerreviewno
dc.source.beginpage1
dc.source.endpage4
dc.source.conferenceMilliemetre Wave Days
dc.source.conferencedate23/05/2011
dc.source.conferencelocationEspoo Finland
imec.availabilityPublished - imec


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