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An analytical compact model for estimation of stress in multiple through-silicon via configurations

dc.contributor.authorEneman, Geert
dc.contributor.authorCho, Jong Hoon
dc.contributor.authorMoroz, Victor
dc.contributor.authorMilojevic, Dragomir
dc.contributor.authorChoi, Munkang
dc.contributor.authorDe Meyer, Kristin
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorBeyne, Eric
dc.contributor.authorHoffmann, Thomas Y.
dc.contributor.authorVan der Plas, Geert
dc.date.accessioned2021-10-19T13:26:02Z
dc.date.available2021-10-19T13:26:02Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18885
dc.sourceIIOimport
dc.titleAn analytical compact model for estimation of stress in multiple through-silicon via configurations
dc.typeProceedings paper
dc.contributor.imecauthorEneman, Geert
dc.contributor.imecauthorMilojevic, Dragomir
dc.contributor.imecauthorDe Meyer, Kristin
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.orcidimecEneman, Geert::0000-0002-5849-3384
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.source.peerreviewyes
dc.source.beginpage505
dc.source.endpage506
dc.source.conferenceDesign, Automation and Test in Europe Conference - DATE
dc.source.conferencedate14/03/2011
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec


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