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High speed full wafer monitoring of surface, edge and bonding interface for 3D-stacking

dc.contributor.authorHalder, Sandip
dc.contributor.authorJourdain, Anne
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorMiller, Andy
dc.contributor.authorGuittet, Pierre-Yves
dc.date.accessioned2021-10-19T14:05:38Z
dc.date.available2021-10-19T14:05:38Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19030
dc.sourceIIOimport
dc.titleHigh speed full wafer monitoring of surface, edge and bonding interface for 3D-stacking
dc.typeProceedings paper
dc.contributor.imecauthorHalder, Sandip
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorMiller, Andy
dc.contributor.orcidimecHalder, Sandip::0000-0002-6314-2685
dc.source.peerreviewyes
dc.source.conference13th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate7/11/2011
dc.source.conferencelocationSingapore
imec.availabilityPublished - imec


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